Huawei and Intel signed a Memorandum of cooperation
In the framework of the Hannover Messe exhibition in 2017, held in Hannover, Germany, Huawei and Intel signed a Memorandum of understanding and partnership, designed to accelerate the creation of innovative and competitive products and solutions in the field of high performance computing. This agreement is a symbol of the beginning of closer and deeper cooperation between the two corporations in this region. The companies will work together to create HPC solutions based on Huawei servers and cloud platforms on Intel processors, Xeon and the Intel Xeon Phi architecture Omni-Path Architecture.
In the framework of this cooperation, Huawei will set up an HPC innovation centers in Shenzhen, Chengdu and Munich. In these centers, the company will launch joint initiatives, such as application optimization, technical training and events for professional communities, contributing to increase the availability of new HPC solutions and services for customers around the world. On top of that Huawei and Intel plan to conduct joint research and global marketing activities.
“Combining big data, cloud computing, artificial intelligence and traditional HPC technologies opens new opportunities for the industry high performance computing, making it more sustainable. This trend also extends the scope of high performance computing. The process covers a variety of areas ranging from traditional areas such as computer-aided design and simulation, scientific computing and the study of oil and gas to new emerging markets, such as financial services and network security. Huawei effectively combines expert knowledge in the field of engineering and microchips with unique achievements in the field of big data and cloud computing. This gives our company a chance to change the HPC industry and to make maximum use of the opportunities. We will strive to offer customers the most advanced solutions that will help them better compete in growing sectors such as HPC cloud, HPC and HPDA & AI. Intel is the pioneer of the industry high-performance computing, as well as the main partner of Huawei in the field of server technologies. The agreement begins a new era in the history of our cooperation. Together we will enrich the HPC industry innovation and provide the our clients new, more competitive solutions for high-performance computing,” commented the President of the division IT Server Product Line, Huawei Qiu LUN.
“Intel will be happy to expedite the development of the market for HPC solutions is in partnership with Huawei. Intel Xeon, Intel Xeon Phi architecture Intel Omni-Path deliver the performance you need for HPC applications. Intel and Huawei will cooperate closely in product development, innovation laboratories and the technical training. Our partnership will extend to joint marketing activities. We are very excited to work with Huawei and are confident that together we can change the market of high performance computing,” added General Manager, products and technologies Data Center Group Sales Group Peter Chen.
In recent years, Huawei has established cooperation with Intel in the field of HPC. In November last year, Intel took part in organized by Huawei conference on supercomputers SC16 to run HPC platform of the new generation on the basis of all-flash technology FusionServer X6000. In March this year Intel joined Huawei at the international exhibition CeBIT 2017, where they were presented with solutions based on blade servers Intel OPA Huawei E9000.
Huawei offers a variety of HPC-based development with high density servers and KunLun FusionServer for industrial computer-aided design and computing to solve scientific and research tasks. At the moment, Huawei has helped many automakers, large supercomputing centers, universities and research institutions in the deployment of clusters for high performance computing. According to the statistics Agency Gartner, in the fourth quarter of last year Huawei was ranked third in the world in number of shipped servers.
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