Qualcomm Snapdragon 670 will reduce the gap with the flagship processors

This year, Qualcomm has reduced the gap between mobile processors of middle and top segments, introducing the Snapdragon 660, which performance is comparable to last year’s flagship chipset, the Snapdragon 820 and 821 and at the same time supports a number of new technologies available in the Snapdragon 835. From the leaks it is known that the main leader next year from Qualcomm will be a Snapdragon 845. Along with this there is information about two chips — the Snapdragon 635 and 670.

Qualcomm Snapdragon 670

Snapdragon 635 should be the heir released this year 630 Snapdragon processor, while the Snapdragon 670 is an improved version of the Snapdragon 660. Both processors will feature eight cores, while the platform will be radically different from each other.

Available data for Snapdragon 635:

  • made for 14-nm LPE Samsung;
  • includes four productive core Kryo (Cortex-A73) and four energy-efficient core Kryo (Cortex-A53);
  • graphics are 20% stronger installed in the Snapdragon 625;
  • the production will be sold in the first quarter of 2018.

What is known about Snapdragon 670:

  • made for 10-nm process technology Samsung LPE;
  • includes two productive core Kryo 360 (Cortex-A75) and six Kryo energy-efficient cores (Cortex-A55);
  • graphics accelerator Adreno 6xx;
  • technology support ARM DynamIQ;
  • the production will be sold in the first quarter of 2018.

Apparently, Snapdragon 670 power will be located at the current Snapdragon 835. The reduction process should contribute to the improvement of energy efficiency, and new graphics Adreno 600 series will provide performance gains.

Source: droidholic.com

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