59513 Dimensity 800 Is MediaTek's Mid-range 5G SoC

Dimensity 800 Is MediaTek’s Mid-range 5G SoC



MediaTek has announced its second 5G-integrated mobile SoC (system-on-chip). The newly announced Dimensity 800 is a mid-range chipset aimed at low-cost 5G smartphones coming next year. The Taiwanese chipmaker announced the Dimensity 1000, its flagship 5G SoC, last month around the same time. The Dimensity 1000 also marked the company’s return to the flagship SoC market after nearly three years.

MediaTek introduced the Dimesity 800 to media representatives during a press conference in Beijing earlier this week. The company did not disclose any specs, though. As per reports from China, the new chipset will be officially launched in Q1 2020. Dimesity 800-powered handsets will arrive on the market in the second quarter next year.

The MediaTek Dimensity 800 SoC is tipped to equip the same Helio M70 modem that can be found on the Dimensity 1000. Helio M70 can reach downlink speeds of up to 4.7Gbps and uplink speeds of up to 2.5Gbps. It supports both standalone (SA) and non-standalone (NSA) sub-6GHz 5G networks, as well as 5G two carrier aggregation (2CC CA). The latter makes for smoother handoffs between two connection areas, without losing coverage.

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Other rumored specs include an octa-core (2+6) CPU, with two ARM Cortex-A76 cores and six Cortex-A50 cores. MediaTek is once again opting for dual cluster arrangement without any medium core. Having said that, the MediaTek Dimensity 800 is yet to go official, so take these specs with a pinch of salt.

The Dimensity 1000 also features a dual cluster arrangement of four ARM Cortex-A77 cores clocked at 2.6 GHz and four power-efficient Cortex-A55 cores clocked at 2.0GHz. The Oppo Reno3 5G will be the first handset to feature the Dimensity 1000 chipset.

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Dimensity 800 will compete against Snapdragon 765

The MediaTek Dimensity 800 will be competing against the likes of Qualcomm Snapdragon 765 in the mid-range and upper mid-range category. Announced earlier this month, the Snapdragon 765 pairs with the Snapdragon X52 5G modem to deliver downlink speeds of up to 3.7Gbps and uplink speeds of up to 1.6Gbps.

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If the MediaTek Dimensity 800 indeed gets the Helio M70 modem, then it surely has a big advantage over the Snapdragon 765 in terms of data transfer rates. However, the latter has its own advantages too. The Snapdragon 765 is compatible with both mmWave and sub-6GHz 5G networks. MediaTek’s offering doesn’t have support for mmWave.

We’ll possibly get to know more about MediaTek’s latest offering at CES 2020 in Las Vegas in a couple of weeks of time. The company will reportedly demo the chipset at the annual trade show, which commences on January 7, 2020.

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